Flexible Electronic Packaging and Encapsulation Technology by... - 9783527353590
Explore the cutting-edge of electronic device protection with "Flexible Electronic Packaging and Encapsulation Technology." This comprehensive hardback guide, authored by Hong (Peking University) Meng and published by Wiley-VCH Verlag GmbH, delves into the latest advancements in materials and methodologies for creating robust and adaptable electronic packaging. Discover innovative solutions for enhancing the durability and performance of flexible electronic systems, crucial for the next generation of wearable technology, IoT devices, and beyond. Key topics covered include: * Advanced polymer science for flexible substrates * Novel encapsulation techniques for moisture and environmental protection * Thermal management in flexible electronics * Reliability and testing of flexible electronic packages * Applications in emerging technologies This book is an essential resource for researchers, engineers, and students working in the field of microelectronics, materials science, and electronic packaging. Gain insights into the challenges and opportunities shaping the future of electronics. Product Summary: Flexible Electronic Packaging and Encapsulation Technology, Hardback, Wiley-VCH Verlag GmbH, authored by Hong (Peking University) Meng, covers advanced materials, encapsulation techniques, thermal management, reliability, and applications for flexible electronics.
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Details:Flexible Electronic Packaging and Encapsulation Technology by... - 9783527353590
Explore the cutting-edge of electronic device protection with "Flexible Electronic Packaging and Encapsulation Technology." This comprehensive hardback guide, authored by Hong (Peking University) Meng and published by Wiley-VCH Verlag GmbH, delves into the latest advancements in materials and methodologies for creating robust and adaptable electronic packaging. Discover innovative solutions for enhancing the durability and performance of flexible electronic systems, crucial for the next generation of wearable technology, IoT devices, and beyond. Key topics covered include: * Advanced polymer science for flexible substrates * Novel encapsulation techniques for moisture and environmental protection * Thermal management in flexible electronics * Reliability and testing of flexible electronic packages * Applications in emerging technologies This book is an essential resource for researchers, engineers, and students working in the field of microelectronics, materials science, and electronic packaging. Gain insights into the challenges and opportunities shaping the future of electronics. Product Summary: Flexible Electronic Packaging and Encapsulation Technology, Hardback, Wiley-VCH Verlag GmbH, authored by Hong (Peking University) Meng, covers advanced materials, encapsulation techniques, thermal management, reliability, and applications for flexible electronics.
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Product Description
Explore the cutting-edge of electronic device protection with "Flexible Electronic Packaging and Encapsulation Technology." This comprehensive hardback guide, authored by Hong (Peking University) Meng and published by Wiley-VCH Verlag GmbH, delves into the latest advancements in materials and methodologies for creating robust and adaptable electronic packaging. Discover innovative solutions for enhancing the durability and performance of flexible electronic systems, crucial for the next generation of wearable technology, IoT devices, and beyond. Key topics covered include: * Advanced polymer science for flexible substrates * Novel encapsulation techniques for moisture and environmental protection * Thermal management in flexible electronics * Reliability and testing of flexible electronic packages * Applications in emerging technologies This book is an essential resource for researchers, engineers, and students working in the field of microelectronics, materials science, and electronic packaging. Gain insights into the challenges and opportunities shaping the future of electronics. Product Summary: Flexible Electronic Packaging and Encapsulation Technology, Hardback, Wiley-VCH Verlag GmbH, authored by Hong (Peking University) Meng, covers advanced materials, encapsulation techniques, thermal management, reliability, and applications for flexible electronics.
Product Specifications
General | |
|---|---|
format | hardcover |
Language | english |
type | textbook |
Brand | Wiley-VCH Verlag GmbH |
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